P80C32EFBB
vs
S80C32-1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MATRA MHS
|
| Package Description |
QFP,
|
QCCJ,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQCC-J44
|
| Length |
10 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
2
|
| Number of I/O Lines |
32
|
32
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Number of Timers |
3
|
3
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
|
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
256
|
256
|
| ROM (words) |
0
|
0
|
| Seated Height-Max |
2.1 mm
|
|
| Speed |
8 MHz
|
16 MHz
|
| Supply Current-Max |
24.78 mA
|
28 mA
|
| Supply Voltage-Max |
6 V
|
5.5 V
|
| Supply Voltage-Min |
4 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
4
|
| Additional Feature |
|
BOOLEAN PROCESSOR
|
| ROM Programmability |
|
ROM LESS
|
|
|
|
Compare P80C32EFBB with alternatives
Compare S80C32-1 with alternatives