P80C32X2BBD,157 vs AT87C52X2-3CSUV feature comparison

P80C32X2BBD,157 NXP Semiconductors

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AT87C52X2-3CSUV Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS MICROCHIP TECHNOLOGY INC
Part Package Code QFP
Package Description 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-389-1, LQFP-44 GREEN, PLASTIC, DIP-40
Pin Count 44
Manufacturer Package Code SOT389-1
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Additional Feature ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 33 MHz 60 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G44 R-PDIP-T40
JESD-609 Code e3 e3
Length 10 mm 51.75 mm
Moisture Sensitivity Level 1
Number of I/O Lines 32 32
Number of Terminals 44 40
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP DIP
Package Equivalence Code QFP44,.47SQ,32 DIP40,.6
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
Seated Height-Max 1.6 mm 5.08 mm
Speed 33 MHz 60 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 2
ECCN Code 3A991.A.2
On Chip Program ROM Width 8
ROM (words) 8192
ROM Programmability OTPROM

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