P80C32X2BBD,157 vs AT89C52-24JC feature comparison

P80C32X2BBD,157 NXP Semiconductors

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AT89C52-24JC Atmel Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ATMEL CORP
Part Package Code QFP LPCC
Package Description 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-389-1, LQFP-44 PLASTIC, MS-018AC, LCC-44
Pin Count 44 44
Manufacturer Package Code SOT389-1
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP Microchip
Has ADC NO NO
Additional Feature ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 33 MHz 24 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G44 S-PQCC-J44
JESD-609 Code e3 e0
Length 10 mm 16.5862 mm
Moisture Sensitivity Level 1
Number of I/O Lines 32 32
Number of Terminals 44 44
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QCCJ
Package Equivalence Code QFP44,.47SQ,32 LCC44,.65SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
Seated Height-Max 1.6 mm 4.57 mm
Speed 33 MHz 24 MHz
Supply Voltage-Max 5.5 V 6 V
Supply Voltage-Min 4.5 V 4 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin (Sn) TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 16.5862 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
On Chip Program ROM Width 8
ROM (words) 8192
ROM Programmability FLASH

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Compare AT89C52-24JC with alternatives