P80C32X2BBD,157 vs P87C52T2-1 feature comparison

P80C32X2BBD,157 NXP Semiconductors

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P87C52T2-1 Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code QFP DIP
Package Description 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-389-1, LQFP-44 PLASTIC, DIP-40
Pin Count 44 40
Manufacturer Package Code SOT389-1
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Additional Feature ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051
Clock Frequency-Max 33 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G44 R-PDIP-T40
JESD-609 Code e3 e0
Length 10 mm 52.324 mm
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of I/O Lines 32 32
Number of Terminals 44 40
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP DIP
Package Equivalence Code QFP44,.47SQ,32
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified
RAM (bytes) 256
Seated Height-Max 1.6 mm 5.715 mm
Speed 33 MHz 16 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin (Sn) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 10 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 2
Pbfree Code No
ROM Programmability OTPROM

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