P80C32X2BBD,157 vs TS80C32X2-LJBD feature comparison

P80C32X2BBD,157 NXP Semiconductors

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TS80C32X2-LJBD Atmel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ATMEL CORP
Part Package Code QFP LCC
Package Description 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-389-1, LQFP-44 QCCJ,
Pin Count 44 44
Manufacturer Package Code SOT389-1
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Additional Feature ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051
Clock Frequency-Max 33 MHz 30 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G44 S-PQCC-J44
JESD-609 Code e3 e3
Length 10 mm 16.5862 mm
Moisture Sensitivity Level 1
Number of I/O Lines 32 32
Number of Terminals 44 44
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QCCJ
Package Equivalence Code QFP44,.47SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256
Seated Height-Max 1.6 mm 4.57 mm
Speed 33 MHz 30 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 2.7 V
Supply Voltage-Nom 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 16.5862 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
ECCN Code 3A991.A.2

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