P80C32X2BBD
vs
SAB8032B-N
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
INFINEON TECHNOLOGIES AG
|
| Package Description |
QFP, QFP44,.47SQ,32
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQCC-J44
|
| JESD-609 Code |
e3
|
e0
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QCCJ
|
| Package Equivalence Code |
QFP44,.47SQ,32
|
LDCC44,.7SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
256
|
| Speed |
33 MHz
|
12 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
2
|
2
|
| Supply Current-Max |
|
175 mA
|
| Supply Voltage-Nom |
|
5 V
|
|
|
|