P87C51RB2FA
vs
S87C654-4F40
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| JESD-30 Code |
S-PQCC-J44
|
R-XDIP-T40
|
| Number of Terminals |
44
|
40
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC44,.7SQ
|
DIP40,.6
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
512
|
256
|
| ROM (words) |
16384
|
16384
|
| ROM Programmability |
UVPROM
|
UVPROM
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Current-Max |
0.05 mA
|
25 mA
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
2
|
3
|
| Package Description |
|
DIP-40
|
| JESD-609 Code |
|
e0
|
| Supply Voltage-Nom |
|
5 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|