P89C51RC2BN/01,112 vs P89C51RD2BN/01 feature comparison

P89C51RC2BN/01,112 NXP Semiconductors

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P89C51RD2BN/01 Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP40,.6 DIP, DIP40,.6
Pin Count 40
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO
Address Bus Width 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 33 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
JESD-609 Code e3
Length 52 mm
Number of I/O Lines 32
Number of Terminals 40 40
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 1024
ROM (words) 32768 65536
ROM Programmability FLASH FLASH
Seated Height-Max 4.7 mm
Speed 33 MHz 33 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Base Number Matches 1 2
Supply Current-Max 40.2 mA

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