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P89C51RD2BN/01 vs P89C51RC2BN/01,112 feature comparison

P89C51RD2BN/01 Philips Semiconductors

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P89C51RC2BN/01,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP40,.6 DIP, DIP40,.6
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Bit Size 8 8
CPU Family 8051 8051
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Number of Terminals 40 40
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 1024 512
ROM (words) 65536 32768
ROM Programmability FLASH FLASH
Speed 33 MHz 33 MHz
Supply Current-Max 40.2 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 40
ECCN Code 3A991.A.2
Has ADC NO
Address Bus Width 16
Clock Frequency-Max 33 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 8
JESD-609 Code e3
Length 52 mm
Number of I/O Lines 32
On Chip Program ROM Width 8
PWM Channels YES
Seated Height-Max 4.7 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 5 V
Terminal Finish TIN
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Microcontrollers and Processors » Microcontrollers
Microcontrollers and Processors » Microcontrollers

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