P89LV51RC2BN vs TSC87C52-25IJ feature comparison

P89LV51RC2BN NXP Semiconductors

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TSC87C52-25IJ Temic Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEMIC SEMICONDUCTORS
Part Package Code DIP
Package Description 0.600 INCH, PLASTIC, MO-015, SOT-129-1, DIP-40
Pin Count 40
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 33 MHz 25 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-CDIP-T40
Length 52 mm
Number of I/O Lines 32 32
Number of Terminals 40 40
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES NO
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 1024 256
ROM (words) 32768 8192
ROM Programmability FLASH UVPROM
Seated Height-Max 4.7 mm
Speed 33 MHz 25 MHz
Supply Current-Max 30 mA 36.25 mA
Supply Voltage-Max 3.6 V 5.5 V
Supply Voltage-Min 3 V 5 V
Supply Voltage-Nom 3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
JESD-609 Code e0
Terminal Finish TIN LEAD

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