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P89V51RD2BN,112 vs P89C51RC2BN/01 feature comparison

P89V51RD2BN,112 NXP Semiconductors

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P89C51RC2BN/01 Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description 0.600 INCH, PLASTIC, MO-015, DIP-40 DIP, DIP40,.6
Pin Count 40
Manufacturer Package Code SOT129-1
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO
Address Bus Width 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 40 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
JESD-609 Code e3 e3
Length 52 mm
Moisture Sensitivity Level 1
Number of I/O Lines 32
Number of Terminals 40 40
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 1024 512
ROM (words) 65536 32768
ROM Programmability FLASH FLASH
Seated Height-Max 4.7 mm
Speed 40 MHz 33 MHz
Supply Current-Max 50 mA 40.2 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Base Number Matches 1 2
Microcontrollers and Processors » Microcontrollers
Microcontrollers and Processors » Microcontrollers

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