P89V51RD2BN
vs
P89C51RC2BN/01
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
DIP-40
|
DIP, DIP40,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
| JESD-609 Code |
e3
|
e3
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP40,.6
|
DIP40,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
1024
|
512
|
| ROM (words) |
65536
|
32768
|
| ROM Programmability |
FLASH
|
FLASH
|
| Speed |
40 MHz
|
33 MHz
|
| Supply Current-Max |
50 mA
|
40.2 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
|
|
|