PACE1757M-30PGMB
vs
MC68010R8D
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
MOTOROLA INC
|
| Part Package Code |
PGA
|
|
| Pin Count |
68
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
24
|
| Bit Size |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
30 MHz
|
8 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-CPGA-P68
|
S-CPGA-P68
|
| Length |
28.5623 mm
|
26.92 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
8
|
3
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
68
|
68
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Seated Height-Max |
4.572 mm
|
2.59 mm
|
| Speed |
30 MHz
|
8 MHz
|
| Supply Current-Max |
310 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
28.5623 mm
|
26.92 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
2
|
| Package Description |
|
PGA,
|
|
|
|
Compare PACE1757M-30PGMB with alternatives
Compare MC68010R8D with alternatives