PC7457VGHU1000LC vs MC7457RX1000LC feature comparison

PC7457VGHU1000LC e2v technologies

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MC7457RX1000LC Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer E2V TECHNOLOGIES PLC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483
Pin Count 483 483
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width 36 36
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 167 MHz 167 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B483 S-CBGA-B483
Length 29 mm 29 mm
Low Power Mode YES YES
Number of Terminals 483 483
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.2 mm
Speed 1000 MHz 1000 MHz
Supply Voltage-Max 1.35 V 1.35 V
Supply Voltage-Min 1.25 V 1.25 V
Supply Voltage-Nom 1.3 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code BGA483,22X22,50
Peak Reflow Temperature (Cel) 245
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC7457RX1000LC with alternatives