PC8240VTPU200C
vs
MPC8245LZU266D
feature comparison
| Rohs Code |
|
No
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
NXP SEMICONDUCTORS
|
| Package Description |
|
35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352
|
| Reach Compliance Code |
|
unknown
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
66 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-PBGA-B352
|
| JESD-609 Code |
|
e0
|
| Length |
|
35 mm
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of Terminals |
|
352
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LBGA
|
| Package Equivalence Code |
|
BGA352,26X26,50
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
|
220
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.65 mm
|
| Speed |
|
266 MHz
|
| Supply Voltage-Max |
|
2.1 V
|
| Supply Voltage-Min |
|
1.7 V
|
| Supply Voltage-Nom |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
|
1
|
|
|
|
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