PCA82C200T
vs
PCA82C200T
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS COMPONENTS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
,
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Additional Feature |
MULTI-MASTER ARCHITECTURE; 10 BYTE MEMORY OF TRANSMIT BUFFER; 20 BYTE MEMORY OF RECEIVER BUFFERS
|
|
| Address Bus Width |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| Length |
17.9 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
|
|
| Number of Serial I/Os |
2
|
2
|
| Number of Terminals |
28
|
28
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Current-Max |
15 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare PCA82C200T with alternatives
Compare PCA82C200T with alternatives