PCA9544ABS,118
vs
PCA9544ABS
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-662-1, HVQFN-20
|
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
SOT662-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
ALSO OPERATES WITH 3.6 TO 5.5V SUPPLY
|
|
| Family |
9544
|
|
| JESD-30 Code |
S-PQCC-N20
|
S-PQCC-N20
|
| JESD-609 Code |
e4
|
e0
|
| Length |
5 mm
|
|
| Logic IC Type |
MULTIPLEXER
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Inputs |
2
|
|
| Number of Outputs |
1
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Packing Method |
TR, 13 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.3 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5 mm
|
|
| Base Number Matches |
1
|
2
|
| Package Equivalence Code |
|
LCC20,.20SQ,25
|
| Supply Current-Max |
|
0.1 mA
|
|
|
|
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