PCF85063AT/AY
vs
PCF85063AT
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
|
SOP,
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
SOT96-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
15 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
| External Data Bus Width |
|
|
| Information Access Method |
SERIAL(I2C)
|
SERIAL(I2C)
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Length |
4.9 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Number of Timers |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
0.9 V
|
0.9 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3.9 mm
|
3.9 mm
|
| uPs/uCs/Peripheral ICs Type |
TIMER, REAL TIME CLOCK
|
TIMER, REAL TIME CLOCK
|
| Base Number Matches |
1
|
11
|
|
|
|
Compare PCF85063AT/AY with alternatives
Compare PCF85063AT with alternatives