PCI1510PGEG4
vs
PCI1410GGU
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
GREEN, PLASTIC, QFP-144
|
PLASTIC, BGA-144
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Address Bus Width |
32
|
32
|
| Bus Compatibility |
PCI
|
PCI; ISA; CARDBUS
|
| Clock Frequency-Max |
33 MHz
|
33.33 MHz
|
| Data Transfer Rate-Max |
130 MBps
|
130 MBps
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PQFP-G144
|
S-PBGA-B144
|
| JESD-609 Code |
e4
|
e0
|
| Length |
20 mm
|
12 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFBGA
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
220
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
1.6 mm
|
1.4 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
20 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCMCIA
|
BUS CONTROLLER, PCMCIA
|
| Base Number Matches |
1
|
2
|
|
|
|
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