PEF2055
vs
DS2181AQ
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
DALLAS SEMICONDUCTOR
|
Package Description |
QCCJ,
|
PLASTIC, LCC-44
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
Length |
16.6 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Supply Current-Max |
9.5 mA
|
10 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
TIME SLOT ASSIGNER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
16.6 mm
|
|
Base Number Matches |
4
|
3
|
Rohs Code |
|
No
|
Carrier Type |
|
CEPT PCM-30/E-1
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
LDCC44,.7SQ
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare PEF2055 with alternatives