PI3C3126LEX
vs
PI3B3125QE
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
Tssop, Tssop14,.25
|
Ssop, Ssop16,.25
|
| Pin Count |
14
|
16
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
Cb3q/3vh/3c/2b
|
Cbtlv/3b
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 Mm
|
4.9 Mm
|
| Logic IC Type |
Bus Driver
|
Bus Driver
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
1
|
4
|
| Number of Functions |
4
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-State
|
3-State
|
| Output Polarity |
True
|
True
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TSSOP
|
SSOP
|
| Package Equivalence Code |
TSSOP14,.25
|
SSOP16,.25
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Thin Profile, Shrink Pitch
|
Small Outline, Shrink Pitch
|
| Propagation Delay (tpd) |
0.25 Ns
|
0.25 Ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 Mm
|
1.75 Mm
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Matte Tin
|
Matte Tin
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
0.635 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Width |
4.4 Mm
|
3.9116 Mm
|
| Base Number Matches |
2
|
2
|
| Additional Feature |
|
Bus Switch
|
|
|
|