PIC12F508-E/P
vs
ACE1502EMT
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
DIP
|
|
Package Description |
0.300 INCH, LEAD FREE, PLASTIC, DIP-8
|
TSSOP-14
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
6 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Has ADC |
NO
|
NO
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
PIC12
|
|
Clock Frequency-Max |
4 MHz
|
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G14
|
JESD-609 Code |
e3
|
|
Length |
9.271 mm
|
5 mm
|
Number of I/O Lines |
6
|
8
|
Number of Terminals |
8
|
14
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
NO
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSSOP
|
Package Equivalence Code |
DIP8,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
RAM (bytes) |
25
|
|
ROM (words) |
768
|
|
ROM Programmability |
FLASH
|
EEPROM
|
Seated Height-Max |
5.334 mm
|
1.1 mm
|
Speed |
4 MHz
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
2 V
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
4.4 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER
|
Base Number Matches |
1
|
2
|
|
|
|
Compare PIC12F508-E/P with alternatives
Compare ACE1502EMT with alternatives