PIC16C54-LPE/JW
vs
PIC16C54-LPSO
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP18,.3
|
SOP,
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
PIC
|
PIC16
|
| Clock Frequency-Max |
0.2 MHz
|
0.032 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-XDIP-T18
|
R-PDSO-G18
|
| Length |
22.987 mm
|
11.53 mm
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
12
|
12
|
| Number of Terminals |
18
|
18
|
| Number of Timers |
1
|
1
|
| On Chip Program ROM Width |
8
|
12
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP18,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
25
|
25
|
| ROM (words) |
512
|
512
|
| ROM Programmability |
UVPROM
|
OTPROM
|
| Screening Level |
ISO/TS-16949
|
|
| Speed |
0.01 MHz
|
0.032 MHz
|
| Supply Voltage-Max |
6.25 V
|
6.25 V
|
| Supply Voltage-Min |
2.5 V
|
3 V
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.49 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
3
|
4
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-609 Code |
|
e3
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| On Chip Data RAM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| RAM (words) |
|
25
|
| Seated Height-Max |
|
2.64 mm
|
| Supply Current-Max |
|
2.4 mA
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare PIC16C54-LPE/JW with alternatives
Compare PIC16C54-LPSO with alternatives