PIC16C55-LPI/SSXXX
vs
PIC16C55-LPESO
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SSOP
|
SOIC
|
| Package Description |
SSOP, SSOP28,.3
|
0.300 INCH, PLASTIC, MS-013, SO-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
PIC
|
PIC
|
| Clock Frequency-Max |
0.032 MHz
|
40 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| Length |
10.2 mm
|
17.87 mm
|
| Number of I/O Lines |
20
|
20
|
| Number of Terminals |
28
|
28
|
| Number of Timers |
1
|
1
|
| On Chip Program ROM Width |
8
|
12
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SOP
|
| Package Equivalence Code |
SSOP28,.3
|
SOP28,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
24
|
24
|
| ROM (words) |
512
|
512
|
| ROM Programmability |
UVPROM
|
OTPROM
|
| Speed |
0.01 MHz
|
40 MHz
|
| Supply Current-Max |
0.04 mA
|
0.055 mA
|
| Supply Voltage-Max |
6.25 V
|
6 V
|
| Supply Voltage-Min |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom |
3 V
|
3.25 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.25 mm
|
7.49 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
5
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A991.A.2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of DMA Channels |
|
|
| On Chip Data RAM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| RAM (words) |
|
24
|
| Seated Height-Max |
|
2.64 mm
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare PIC16C55-LPI/SSXXX with alternatives
Compare PIC16C55-LPESO with alternatives