PIC17C756-33/P
vs
PIC17C756A-33I/LVAO
feature comparison
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
LCC
|
| Package Description |
0.750 INCH, PLASTIC, SDIP-64
|
PLASTIC, MO-047, LCC-68
|
| Pin Count |
64
|
68
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| CPU Family |
PIC
|
PIC17
|
| Clock Frequency-Max |
33 MHz
|
33 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
16
|
8
|
| JESD-30 Code |
R-PDIP-T64
|
S-PQCC-J68
|
| Length |
57.658 mm
|
24.23 mm
|
| Number of I/O Lines |
50
|
50
|
| Number of Terminals |
64
|
68
|
| On Chip Program ROM Width |
8
|
16
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SDIP
|
QCCJ
|
| Package Equivalence Code |
SDIP64,.75
|
LDCC68,1.0SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE, SHRINK PITCH
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
902
|
902
|
| ROM (words) |
16384
|
16384
|
| ROM Programmability |
OTPROM
|
OTPROM
|
| Seated Height-Max |
5.08 mm
|
4.57 mm
|
| Speed |
33 MHz
|
33 MHz
|
| Supply Current-Max |
50 mA
|
30 mA
|
| Supply Voltage-Max |
6 V
|
5.5 V
|
| Supply Voltage-Min |
5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
1.778 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
19.05 mm
|
24.23 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
1998-07-31
|
| Boundary Scan |
|
NO
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-609 Code |
|
e3
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of External Interrupts |
|
18
|
| Number of Serial I/Os |
|
1
|
| Number of Timers |
|
4
|
| On Chip Data RAM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare PIC17C756-33/P with alternatives
Compare PIC17C756A-33I/LVAO with alternatives