PIC17C756-33/SP
vs
PIC17C756AT-33E/CL
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIP
|
LCC
|
Package Description |
0.750 INCH, SHRINK, PLASTIC, DIP-64
|
WINDOWED, LCC-68
|
Pin Count |
64
|
68
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
33 MHz
|
33 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
R-PDIP-T64
|
S-CQCC-J68
|
Length |
57.655 mm
|
24.13 mm
|
Number of I/O Lines |
50
|
50
|
Number of Terminals |
64
|
68
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SDIP
|
WQCCJ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE, SHRINK PITCH
|
CHIP CARRIER, WINDOW
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
OTPROM
|
UVPROM
|
Seated Height-Max |
5.08 mm
|
4.7 mm
|
Speed |
8 MHz
|
33 MHz
|
Supply Voltage-Max |
6 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
1.778 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
19.05 mm
|
24.13 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
On Chip Program ROM Width |
|
16
|
RAM (bytes) |
|
902
|
ROM (words) |
|
16384
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare PIC17C756-33/SP with alternatives
Compare PIC17C756AT-33E/CL with alternatives