PIC17C756AT-33/CL
vs
PIC17C756-33/JW
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
LCC
|
DIP
|
| Package Description |
WINDOWED, LCC-68
|
WINDOWED, CERDIP-68
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
33 MHz
|
33 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-CQCC-J68
|
R-CDIP-T68
|
| JESD-609 Code |
e3
|
|
| Length |
24.13 mm
|
|
| Number of I/O Lines |
50
|
50
|
| Number of Terminals |
68
|
68
|
| On Chip Program ROM Width |
16
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
WQCCJ
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, WINDOW
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
902
|
|
| ROM (words) |
16384
|
|
| ROM Programmability |
UVPROM
|
UVPROM
|
| Seated Height-Max |
4.7 mm
|
|
| Speed |
33 MHz
|
33 MHz
|
| Supply Voltage-Max |
5.5 V
|
6 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
24.13 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Supply Current-Max |
|
50 mA
|
|
|
|
Compare PIC17C756AT-33/CL with alternatives
Compare PIC17C756-33/JW with alternatives