PIC17C762-16E/PT
vs
PIC17C762T-16E/PT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
12 X 12 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-80
|
12 X 12 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-80
|
Pin Count |
80
|
80
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G80
|
JESD-609 Code |
e3
|
e3
|
Length |
12 mm
|
12 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of I/O Lines |
66
|
66
|
Number of Terminals |
80
|
80
|
On Chip Program ROM Width |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFQFP
|
TFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
678
|
678
|
ROM (words) |
8192
|
8192
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Speed |
16 MHz
|
16 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
12 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare PIC17C762-16E/PT with alternatives
Compare PIC17C762T-16E/PT with alternatives