PIC18C858T-E/PT
vs
PIC18C858ECL
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFN
|
Package Description |
10 X 10 X 1 MM, PLASTIC, TQFP-80
|
WINDOWED, CERPACK-84
|
Pin Count |
80
|
84
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
OPERATES AT 2.5V MINIMUM SUPPLY
|
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G80
|
S-CQCC-J84
|
JESD-609 Code |
e3
|
e3
|
Length |
12 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
67
|
68
|
Number of Terminals |
80
|
84
|
On Chip Program ROM Width |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
TFQFP
|
WQCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, WINDOW
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1536
|
1536
|
ROM (words) |
16384
|
16384
|
ROM Programmability |
OTPROM
|
UVPROM
|
Seated Height-Max |
1.2 mm
|
|
Speed |
40 MHz
|
40 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.2 V
|
4.2 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
QUAD
|
Width |
12 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
3
|
2
|
|
|
|
Compare PIC18C858T-E/PT with alternatives
Compare PIC18C858ECL with alternatives