PIC18F14K50I/MQQTP
vs
PIC18LF14K50-I/MQ
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
5 X 5 MM, 0.90 MM HEIGHT, PLASTIC, QFN-20
|
5 X 5 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
48 MHz
|
48 MHz
|
| DAC Channels |
YES
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N20
|
S-PQCC-N20
|
| Length |
5 mm
|
5 mm
|
| Number of I/O Lines |
15
|
17
|
| Number of Terminals |
20
|
20
|
| On Chip Program ROM Width |
8
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| RAM (bytes) |
768
|
768
|
| ROM (words) |
16384
|
8192
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Speed |
16 MHz
|
48 MHz
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
7 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Additional Feature |
|
OPERATES AT 1.8 V MINIMUM SUPPLY AT 20 MHZ
|
| CPU Family |
|
PIC
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
LCC20,.20SQ,25
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
12 mA
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare PIC18F14K50I/MQQTP with alternatives
Compare PIC18LF14K50-I/MQ with alternatives