PIC24EP256GU810-E/PT
vs
DSPIC33EP128MC202-I/SS
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
|
| Part Package Code |
QFP
|
|
| Package Description |
TQFP-100
|
|
| Pin Count |
100
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Factory Lead Time |
6 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Address Bus Width |
|
|
| Bit Size |
16
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
60 MHz
|
|
| External Data Bus Width |
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PQFP-G100
|
|
| JESD-609 Code |
e3
|
|
| Length |
12 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of DMA Channels |
15
|
|
| Number of External Interrupts |
5
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
100
|
|
| Number of Timers |
9
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFQFP
|
|
| Package Equivalence Code |
TQFP100,.55SQ,16
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (words) |
28672
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Current-Max |
320 mA
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.4 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
12 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
|
| Base Number Matches |
1
|
|
|
|
|
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