PIC24F08KL301-E/SO vs PIC24F08KL301-I/P feature comparison

PIC24F08KL301-E/SO Microchip Technology Inc

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PIC24F08KL301-I/P Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 16 16
CPU Family PIC24 PIC24
Clock Frequency-Max 32 MHz 32 MHz
DMA Channels NO NO
External Data Bus Width
JESD-609 Code e3 e3
Length 12.8 mm 26.162 mm
Moisture Sensitivity Level 1
Number of I/O Lines 18 18
Number of Terminals 20 20
PWM Channels YES YES
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
ROM (words) 2048 2730
Speed 32 MHz 32 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Factory Lead Time 6 Weeks
Samacsys Manufacturer Microchip
Additional Feature OPERATES 1.8V AT 8MHZ
Boundary Scan NO
DAC Channels NO
Format FIXED POINT
Integrated Cache NO
JESD-30 Code R-PDIP-T20
Low Power Mode YES
Number of External Interrupts 3
Number of Serial I/Os 2
Number of Timers 6
On Chip Data RAM Width 8
On Chip Program ROM Width 24
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP20,.3
Qualification Status Not Qualified
RAM (bytes) 1024
ROM Programmability FLASH
Screening Level TS 16949
Seated Height-Max 5.334 mm
Supply Current-Max 18 mA
Temperature Grade INDUSTRIAL

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Compare PIC24F08KL301-I/P with alternatives