PMEG3050EP,115
vs
PMEG6020EP,115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOD
|
SOD
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
SOD128
|
SOD128
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.275 V
|
0.53 V
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
70 A
|
50 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
5 A
|
2 A
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Rep Pk Reverse Voltage-Max |
30 V
|
60 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
TIN
|
TIN
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
PLASTIC PACKAGE-2
|
| Application |
|
EFFICIENCY
|
| Diode Element Material |
|
SILICON
|
| JESD-30 Code |
|
R-PDSO-F2
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Power Dissipation-Max |
|
0.625 W
|
| Reference Standard |
|
AEC-Q101; IEC-60134
|
| Reverse Current-Max |
|
150 µA
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
DUAL
|
|
|
|