PN5120A0HN/C2
vs
PN5120A0HN1/C1,157
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN,
|
5 X 5 MM X 0.85 MM HEIGHT, PLASTIC, SOT-617, HVQFN-32
|
Pin Count |
40
|
32
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQCC-N40
|
S-PQCC-N32
|
Length |
6 mm
|
5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
6 mm
|
5 mm
|
Base Number Matches |
4
|
1
|
Rohs Code |
|
Yes
|
Manufacturer Package Code |
|
SOT617-1
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-30 °C
|
Package Equivalence Code |
|
LCC32,.2SQ,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Temperature Grade |
|
OTHER
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare PN5120A0HN/C2 with alternatives
Compare PN5120A0HN1/C1,157 with alternatives