PPC440EP-3TB400CZ
vs
PPC440EP-3JC400C
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
APPLIED MICRO CIRCUITS CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA456,26X26,50
|
BGA, BGA456,26X26,50
|
| Pin Count |
456
|
456
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 2.5 AND 3.3V SUPPLY
|
ALSO REQUIRES 2.5 AND 3.3V SUPPLY
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66.66 MHz
|
66.66 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
| Length |
35 mm
|
35 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
456
|
456
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA456,26X26,50
|
BGA456,26X26,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Speed |
400 MHz
|
400 MHz
|
| Supply Current-Max |
2200 mA
|
2200 mA
|
| Supply Voltage-Max |
1.6 V
|
1.6 V
|
| Supply Voltage-Min |
1.4 V
|
1.4 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
35 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare PPC440EP-3TB400CZ with alternatives
Compare PPC440EP-3JC400C with alternatives