PPC440GP-3RC466C vs IBM25PPC440GP-3CC466C feature comparison

PPC440GP-3RC466C Applied Micro Circuits Corporation

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IBM25PPC440GP-3CC466C IBM

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer APPLIED MICRO CIRCUITS CORP IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description BGA, BGA552,24X24,40 BGA, BGA552,24X24,40
Pin Count 552 552
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 64 64
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.66 MHz
External Data Bus Width 64 64
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B552 S-CBGA-B552
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 552 552
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA552,24X24,40 BGA552,24X24,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.8 mm 3.8 mm
Speed 466 MHz 466 MHz
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2

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Compare IBM25PPC440GP-3CC466C with alternatives