PPC5668GF0AVMGR
vs
PPC5668GF0AVMG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208
|
17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO151AAF-1, MAPBGA-208
|
Pin Count |
208
|
208
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991
|
3A991
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
JESD-609 Code |
e2
|
e2
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2 mm
|
2 mm
|
Speed |
116 MHz
|
116 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver (Sn/Ag)
|
Tin/Silver (Sn/Ag)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
17 mm
|
17 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
2
|
|
|
|