PTN3380BBS,518
vs
BD2200GUL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROHM CO LTD
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT619-1, VQFN-48
|
VFBGA,
|
| Pin Count |
48
|
6
|
| Manufacturer Package Code |
SOT619-1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Factory Lead Time |
4 Weeks
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-PQCC-N48
|
R-PBGA-B6
|
| JESD-609 Code |
e4
|
e1
|
| Length |
7 mm
|
1.5 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1 mm
|
0.55 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
7 mm
|
1 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare PTN3380BBS,518 with alternatives
Compare BD2200GUL with alternatives