QD27C256-25 vs SMJ27C256JM feature comparison

QD27C256-25 Intel Corporation

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SMJ27C256JM Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP28,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns
I/O Type COMMON
JESD-30 Code R-XDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 12.75 V
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Base Number Matches 2 1

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