QU80386EXTC33
vs
MC68302CFE20
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
MOTOROLA INC
|
| Package Description |
TQFP-144
|
QFP, QFP132,1.2SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| Address Bus Width |
26
|
23
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
NO
|
| Clock Frequency-Max |
25 MHz
|
16.67 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G132
|
S-CQFP-G132
|
| Length |
24.13 mm
|
22.355 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
12
|
|
| Number of Serial I/Os |
3
|
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
117 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BQFP
|
QFP
|
| Package Equivalence Code |
SPQFP132,1.1SQ
|
QFP132,1.2SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.57 mm
|
4.31 mm
|
| Speed |
33 MHz
|
20 MHz
|
| Supply Current-Max |
320 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.64 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.13 mm
|
22.355 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
132
|
| JESD-609 Code |
|
e0
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare QU80386EXTC33 with alternatives
Compare MC68302CFE20 with alternatives