R5F100GJANA#U0
vs
R5F100GJANA#V0
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
HWQFN
|
HWQFN
|
| Package Description |
HVQCCN,
|
,
|
| Pin Count |
48
|
48
|
| Manufacturer Package Code |
PWQN0048KB
|
1R020000ZA
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Has ADC |
YES
|
|
| Additional Feature |
IT ALSO OPERATES AT 4MHZ @1.6V MIN SUPPLY @ LOW-VOLTAGE MAIN MODE
|
|
| Address Bus Width |
|
|
| Bit Size |
16
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
20 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N48
|
|
| Length |
7 mm
|
|
| Number of I/O Lines |
44
|
|
| Number of Terminals |
48
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVQCCN
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| RAM (bytes) |
20480
|
|
| ROM (words) |
262144
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
0.8 mm
|
|
| Speed |
32 MHz
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare R5F100GJANA#U0 with alternatives
Compare R5F100GJANA#V0 with alternatives