R5F100LEAFB#30
vs
R5F100LEGFB#X0
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
LFQFP
|
LQFP
|
| Package Description |
,
|
LFQFP,
|
| Pin Count |
64
|
64
|
| Manufacturer Package Code |
PLQP0064KB
|
PLQP0064KF
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Moisture Sensitivity Level |
3
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, CISC
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Has ADC |
|
YES
|
| Additional Feature |
|
IT ALSO OPERATES AT 16MHZ @2.4V MIN SUPPLY
|
| Address Bus Width |
|
|
| Bit Size |
|
16
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
20 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQFP-G64
|
| Length |
|
10 mm
|
| Number of I/O Lines |
|
58
|
| Number of Terminals |
|
64
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFQFP
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| RAM (bytes) |
|
4096
|
| ROM (words) |
|
65536
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.6 mm
|
| Speed |
|
32 MHz
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
10 mm
|
|
|
|
Compare R5F100LEAFB#30 with alternatives
Compare R5F100LEGFB#X0 with alternatives