R5F101ACASP#50 vs R5F101ACASP#X0 feature comparison

R5F101ACASP#50 Renesas Electronics Corporation

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R5F101ACASP#X0 Renesas Electronics Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP RENESAS ELECTRONICS CORP
Part Package Code LSSOP LSSOP
Package Description LSSOP, LSSOP,
Pin Count 30 30
Manufacturer Package Code PLSP0030JB PLSP0030JB
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 12 Weeks
Samacsys Manufacturer Renesas Electronics Renesas Electronics
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, CISC MICROCONTROLLER
Base Number Matches 1 1
Has ADC YES
Additional Feature IT ALSO OPERATES AT 4MHZ @1.6V MIN SUPPLY @ LOW-VOLTAGE MAIN MODE
Address Bus Width
Bit Size 16
Boundary Scan NO
Clock Frequency-Max 20 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width
JESD-30 Code R-PDSO-G30
Length 9.85 mm
Number of I/O Lines 26
Number of Terminals 30
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LSSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
RAM (bytes) 2048
ROM (words) 32768
ROM Programmability FLASH
Seated Height-Max 1.4 mm
Speed 32 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Width 6.1 mm

Compare R5F101ACASP#50 with alternatives

Compare R5F101ACASP#X0 with alternatives