R5F10268ASP#V0
vs
R5F10268GSP#35
feature comparison
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Active
|
| Ihs Manufacturer |
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
|
LSSOP
|
| Package Description |
|
LSSOP,
|
| Pin Count |
|
20
|
| Manufacturer Package Code |
|
PLSP0020JB
|
| Reach Compliance Code |
|
compliant
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
12 Weeks
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| Has ADC |
|
YES
|
| Bit Size |
|
16
|
| Boundary Scan |
|
NO
|
| CPU Family |
|
RL78
|
| Clock Frequency-Max |
|
20 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
YES
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-30 Code |
|
R-PDSO-G20
|
| Length |
|
6.5 mm
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of DMA Channels |
|
2
|
| Number of I/O Lines |
|
18
|
| Number of Serial I/Os |
|
1
|
| Number of Terminals |
|
20
|
| Number of Timers |
|
5
|
| On Chip Data RAM Width |
|
8
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LSSOP
|
| Package Equivalence Code |
|
SSOP20,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| RAM (bytes) |
|
768
|
| ROM (words) |
|
8192
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.45 mm
|
| Speed |
|
24 MHz
|
| Supply Current-Max |
|
5 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
2.7 V
|
| Supply Voltage-Nom |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
4.4 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER
|
| Base Number Matches |
|
1
|
|
|
|
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