R5F2L357ADFP
vs
R5F2L357BNFP
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
10 X 10 MM, 0.65 MM PITCH, PLASTIC, LQFP-52
|
10 X 10 MM, 0.65 MM PITCH, PLASTIC, LQFP-52
|
Pin Count |
52
|
52
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
IT ALSO OPERATES MINI VOLTAGE 1.8V AT 5 MHZ
|
IT ALSO OPERATES MINI VOLTAGE 1.8V AT 5 MHZ
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G52
|
S-PQFP-G52
|
Length |
10 mm
|
10 mm
|
Number of I/O Lines |
41
|
41
|
Number of Terminals |
52
|
52
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
LQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM (words) |
49152
|
49152
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Speed |
20 MHz
|
20 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
10 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare R5F2L357ADFP with alternatives
Compare R5F2L357BNFP with alternatives