R5F2L35ABNFP
vs
R5F2L357BDFP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
10 X 10 MM, 0.65 MM PITCH, PLASTIC, LQFP-52
|
10 X 10 MM, 0.65 MM PITCH, PLASTIC, LQFP-52
|
| Pin Count |
52
|
52
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
IT ALSO OPERATES MINI VOLTAGE 1.8V AT 5 MHZ
|
IT ALSO OPERATES MINI VOLTAGE 1.8V AT 5 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G52
|
S-PQFP-G52
|
| Length |
10 mm
|
10 mm
|
| Number of I/O Lines |
41
|
41
|
| Number of Terminals |
52
|
52
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM (words) |
98304
|
49152
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare R5F2L35ABNFP with alternatives
Compare R5F2L357BDFP with alternatives