R80186 vs MC68HC000FN10 feature comparison

R80186 Intel Corporation

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MC68HC000FN10 Freescale Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP FREESCALE SEMICONDUCTOR INC
Part Package Code LCC LCC
Package Description CERAMIC, LCC-68 QCCJ, LDCC68,1.0SQ
Pin Count 68 68
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 20 23
Bit Size 16 32
Boundary Scan NO NO
Clock Frequency-Max 16 MHz 10 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CQCC-N68 S-PQCC-J68
JESD-609 Code e0 e0
Length 24.13 mm 24.2062 mm
Low Power Mode NO NO
Number of Terminals 68 68
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN QCCJ
Package Equivalence Code LCC68A,.95SQ LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.68 mm 4.57 mm
Speed 8 MHz 10 MHz
Supply Current-Max 550 mA 30 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 24.13 mm 24.2062 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 11 2
ECCN Code EAR99
Samacsys Manufacturer NXP
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC68HC000FN10 with alternatives