RD38F2240WWYDQ0 vs M36L0R8060B1ZAQF feature comparison

RD38F2240WWYDQ0 Intel Corporation

Buy Now Datasheet

M36L0R8060B1ZAQF STMicroelectronics

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP STMICROELECTRONICS
Part Package Code BGA BGA
Package Description LFBGA, BGA88,8X12,32 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88
Pin Count 88 88
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 65 ns
Additional Feature CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e0 e1
Length 10 mm 10 mm
Memory Density 67108864 bit 268435456 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 4194304 words 16777216 words
Number of Words Code 4000000 16000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 4MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA88,8X12,32 BGA88,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Standby Current-Max 0.0001 A 0.00011 A
Supply Current-Max 0.035 mA 0.052 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1

Compare RD38F2240WWYDQ0 with alternatives

Compare M36L0R8060B1ZAQF with alternatives