RD38F2240WWYDQ0 vs MT28C256532W18TFT-F606P706BTWT feature comparison

RD38F2240WWYDQ0 Intel Corporation

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MT28C256532W18TFT-F606P706BTWT Micron Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LFBGA, BGA88,8X12,32 LFBGA,
Pin Count 88 88
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 65 ns
Additional Feature CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e0 e1
Length 10 mm 12 mm
Memory Density 67108864 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 4194304 words 8388608 words
Number of Words Code 4000000 8000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 4MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA88,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 9 mm
Base Number Matches 1 1

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Compare MT28C256532W18TFT-F606P706BTWT with alternatives