RD38F4455LVYTQ0 vs MT28C256532W18SBT-F705P70BBWT feature comparison

RD38F4455LVYTQ0 Intel Corporation

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MT28C256532W18SBT-F705P70BBWT Micron Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LFBGA, BGA88,8X12,32 LFBGA,
Pin Count 88 88
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns
Additional Feature CONTAINS 256M BIT FLASH; CONTAINS 64M BIT PSRAM CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e0 e1
Length 13 mm 12 mm
Memory Density 268435456 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 16777216 words 8388608 words
Number of Words Code 16000000 8000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 16MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA88,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.00015 A
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 2 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 9 mm
Base Number Matches 1 1

Compare RD38F4455LVYTQ0 with alternatives

Compare MT28C256532W18SBT-F705P70BBWT with alternatives